KULLIYYAH OF INFORMATION AND COMMUNICATION TECHNOLOGY
Frame 2 - Wafer
As you can see on the wafer, there are many small squares. These are called the dice. One ‘die’ is a chip, that is going to be embedded into the module to become a smart card. A smart card can be of two types: a memory-based smart card or microprocessor-based smart card. The interface of a smart card can be of contact, contactless or both.
The wafer is then to be mechanically sawn/cut; the process is known as wafer dicing. Each unit is called a ‘die’.
Each unit is then embedded into a module, with die bonding and wire bonding processes.